Katie Nielson, PhD Electrical Engineering

Stanford University
PI Eric Pop; Task #3137.043

Hired by Intel

Previously interned with Intel, TSMC, and Micron

Angel Conrado, MEng Materials Science and Engineering

Boise State University
PI Elton Graugnard; Task #3137.041

Previously interned with Micron

John Hues, PhD Materials Sciences

Boise State University
PI Elton Graugnard; Task #3137.039, 3137.041

Previously interned with Micron

Yawei Zhang, MS Materials Sciences

Cornell University
PI James C. M. Hwang; Task #3137.006, 3137.007

Currently available for internship

Luke Huang, MS Materials Science and Engineering

Cornell University
PI James C.M. Hwang; Task #3137.006, 3137.007

Hired by Amazon Hardware Engineering

Previously interned with Amazon

Jiadi Zhu, PhD Electrical and Electronics Engineering

MIT
PI Tomas Palacios; Task #3137.001, 3137.005

Previously interned with TSMC

Wenwen Zhao, PhD Physics

Cornell University
PI Depdeep Jena; Task #3137.035

Currently available for hire or internship
Previously interned with Qorvo

Bennett Cromer, PhD Materials Science and Engineering

Cornell University
PI Huili Grace Xing; Task #3137.003, 3137.033

Currently available for hire

Kathryn Zhang, MEng Electrical and Computer Engineering

Cornell University
PI Huili Grace Xing; Task #3137.003

Hired by Intel

Previously interned with Corning, Otis Elevator Co, The MITRE Corporation, and Space Systems Design Studio

Kathleen Smith, PhD Engineering Physics/Applied Physics

Cornell University
PI Huili Grace Xing; Task #3137.003, 3137.033

Hired by ASM

Yunxuan Xu, MEng Electrical and Computer Engineering

Cornell University
PI Huili Grace Xing

Currently available for hire

Xiaobo Wang, MS Material Science and Engineering

Cornell University
PI Huili Grace Xing