SUPREME Annual Review August 1-3, 2023

Photo Credit: Robyn Wishna 2023
Huili (Grace) Xing and Tomas Palacios. The Semiconductor Research Corporation (SRC) Sponsors and Defense Advanced Research Projects Agency (DARPA) sponsoring the research are excited for the future research results yet to come and the many talented students that are the workhorses behind the research in the center and that will help power the workforce of tomorrow” ~ Roman Caudillo“The SUPREME Center of the JUMP 2.0 Program held its first Annual Review this week. Thank you to all the students, researchers, faculty members, and industry liaisons for a great event and inspiring start to this 5-year mission to tackle the challenges in developing the high-performance energy-efficient devices that are critically needed for the future needs of the world. The center is off to a strong start thanks to the leadership of Center Directors

Photo Credit: Robyn Wishna 2023

Katie Neilson (PI: Eric Pop, Stanford University) receives the award for Best Lightning Talk Session One for her presentation “Improving and Understanding 2D Material-Based P-Type Transistors”.

Margaret Quinn (PI: James Rondinelli, Northwestern University) receives the award for Best Lightning Talk Session Two for her presentation “Structural Ordered Oxygen Vacancies for Ferroelectric and Magnetoelectric Materials Discovery”.

Arjan Singh (PI: Farhan Rana, Cornell University) receives the award for Best Lightning Talk Session Three for his presentation “Using Chip-Scale Electron Spin Resonance Spectroscopy to Detect Spin-Defects in Semiconductor Thin-Films, Surfaces, and Interfaces”.

Jeremy Thelven (PI: Greg Parsons, North Carolina State University) receives the award for Best Lightning Talk Session Four for his presentation “Inherent Selective Atomic Scale Processing”.

Emma Sponga and Jack Coyle (PI: Daniel Gall, Rensselaer Polytechnic Institute) receive the award for Best Undergraduate Lightning Talk for their presentation “Design and Construction of a Sputter Deposition System to Explore New Interconnect Materials and Interfaces”.
All Photo Credits: Robyn Wishna 2023