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Center 7 of the Joint University Microelectronics Program JUMP 2.0

News

January 31, 2024

On a snowy morning over winter break, the only sound in Duffield Hall’s large, empty atrium was a faint clanking. In a hallway across from the Cornell NanoScale Science and Technology Facility (CNF), the sound grew louder, and through an open classroom door: seven high school students were elbow deep, wrenches and screwdrivers in hand, in a machine worth more than a half-million dollars.

January 30, 2024

State-of-the-art toolset will bridge academic innovations and industry pathways to scale for semiconductors, microelectronics, and other critical technologies.

January 18, 2024

A consortium organized by Cornell and four other New York-based leaders in semiconductor research and development has been awarded $40 million by the U.S. Department of Defense to advance microelectronics innovation and manufacturing.

January 17, 2024

Since its inception SUPREME is continuously growing to currently 150+ students and postdocs who work in close collaboration with 100+ liaisons from all participating SRC companies. At the completion of Year One, we would like to thank our partners and encourage everyone to keep in touch.

January 5, 2024

Professor James Rondinelli discovered the first all-inorganic halide perovskite multiferroic material

December 15, 2023

Congratulations to our excellent students on the many awards and fellowships they received this year!

December 7, 2023

Debdeep Jena, David E. Burr Professor of Engineering  (ECE), will be elevated to IEEE Fellow effective Jan 1, 2024. Jena was elevated for his “contributions to distributed polarization doping in the III-V semiconductor family.” IEEE Fellow is one of the highest honors in IEEE and is conferred to less than 0.1% of voting members of IEEE annually.

December 1, 2023

The Lester F. Eastman Award is named after the late Professor Lester F. Eastman. Professor Eastman, a world leader in the physics and technology of compound semiconductor materials and devices; invented, fabricated, and investigated many novel semiconductor materials and devices. His work on so many occasions resulted in breakthroughs enabling important practical applications. The best solid-state device groups follow his ideas with great success, and his former students and associates work in leadership positions in hundreds of leading companies, research laboratories and universities in the United States and around the globe.

November 29, 2023

Chris Van de Walle, University of California, Santa Barbara For advances in development of rigorous ab initio methodologies for understanding point defects and their effect on light emission in wide-bandgap semiconductors

October 20, 2023

Northwestern Engineering’s James Rondinelli has been elected a 2023 fellow of the American Physical Society (APS).

September 25, 2023

Professor Eric Pop received the 2023 Viskanta Fellowship from the Heat and Mass Transfer group at Purdue University. During his week-long stay at Purdue University, Eric met with faculty in EE, ME, MSE, Physics, and other related departments. Eric’s visit culminated with his 2023 Viskanta Lecture titled, “Thermal Transport in Layered Materials, Devices, and Systems.”

August 29, 2023

Intel has recognized seven leading academic researchers with 2022 Outstanding Researcher Awards (ORAs). The annual award program recognizes exceptional contributions made through Intel university-sponsored research to help further Intel’s mission of creating world-changing technology to improve daily life.