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Superior Energy-efficient Materials and Devices

Center 7 of the Joint University Microelectronics Program JUMP 2.0

Weekly Liaison Meeting Fall 2024 – September through December

September 4, 2024, 4 pm ET: Memory, Kai Ni (Notre Dame) Ferroelectric memory

September 11, 2024, 8 pm ET: Jing Kong (MIT), 2D Materials and Devices

September 18, 2024, 4 pm ET: Spin-based Devices, Dan Ralph (Cornell)

September 25, 2024, 8 pm ET: Advanced Processing, Ultrahigh-k dielectrics (Graugnard group – Boise State)

October 2, 2024: No Liaison Meeting

October 9, 2024: No Liaison Meeting

October 16, 2024, 4 pm ET: Metrology, Farhan Rana (Cornell)

October 23, 2024, 8 pm ET: GaN Devices, Grace Xing (Cornell)

October 30, 2024, 4 pm ET: Memory, Farnaz Niroui (MIT)

November 6, 2024: No Liaison Meeting

November 13, 2024, No Liaison Meeting

November 20, 2024, 8 pm ET: Electric Interconnects (Gall group – RPI)

November 27: No Liaison Meeting

December 4, 2024: 8 pm ET: Memory, Mike Niemier (Notre DamÄ™) / Purdue Seed

December 11, 2024, 4 pm ET: Electric Interconnects, Judy Cha & Zhiting Tian (Cornell – Seed project)

Start Date: December 11, 2024
End Date: December 11, 2024
Location: WebEx